wavesolder              package:faraway              R Documentation

_D_e_f_e_c_t_s _i_n _a _w_a_v_e _s_o_l_d_e_r_i_n_g _p_r_o_c_e_s_s

_D_e_s_c_r_i_p_t_i_o_n:

     Components are attached to an electronic circuit card assembly by
     a wave-soldering process. The soldering process involves baking
     and preheating the circuit card and then passing it through a
     solder wave by conveyor. Defect arise during the process. Design
     is $2^{7-3}$ with 3 replicates.

_U_s_a_g_e:

     data(wavesolder)

_F_o_r_m_a_t:

     A data frame with 16 observations on the following 10 variables.

     _y_1 Number of defects in the first replicate

     _y_2 Number of defects in the second replicate

     _y_3 Number of defects in the third replicate

     _p_r_e_b_a_k_e prebake condition - a factor with levels '1' '2'

     _f_l_u_x flux density - a factor with levels '1' '2'

     _s_p_e_e_d conveyor speed - a factor with levels '1' '2'

     _p_r_e_h_e_a_t preheat condition - a factor with levels '1' '2'

     _c_o_o_l_i_n_g cooling time - a factor with levels '1' '2'

     _a_g_i_t_a_t_o_r ultrasonic solder agitator - a factor with levels '1' '2'

     _t_e_m_p solder temperature - facctor with levels '1' '2'

_S_o_u_r_c_e:

     L. Condra (1993) Reliability improvement with design of
     experiments. Marcel Dekker, NY.

_R_e_f_e_r_e_n_c_e_s:

     M. Hamada and J. Nelder (1997) Generalized linear models for
     quality improvement experiments, Journal of Quality Technology,
     29, 292-304

